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BackExposed, http://www.st.com/resource/en/datasheet/stm6600.pdf TDFN, 14 Pin (http://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-BE, 40 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42820-22XX, 2 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63M-1P-3.96DSA, 1 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3391, 33 Circuits (https://www.molex.com/pdm_docs/sd/5022313300_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0190, 19 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.1 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 horizontal Hirose DF13 through hole, DF13-13P-1.25DSA, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PUD series connector, 502443-0670 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B10P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator connector JST EH series connector, B14B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 14 Pin (https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf#page=28), generated with kicad-footprint-generator JST EH.
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