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4.9mm, pitch 10mm Varistor, diameter 12mm, width 4.5mm, pitch 7.5mm size 92.3x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-505 45Degree pitch 5mm size 60x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00294, 9 pins, pitch 2.54mm, size 25.9x6.2mm^2, drill diamater 1.3mm, pad diameter 2.8mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310111_RT055xxHBLC_OFF-022717S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type067_RT01903HDWC pitch 10mm Varistor, diameter 15.5mm, width 7.2mm, pitch 7.5mm size 30x11mm^2 drill 1.4mm pad 2.7mm terminal block RND 205-00068 pitch 7.5mm Varistor, diameter 16.5mm, width 6.7mm, pitch 5mm, size 46.5x15mm^2, drill diamater 1.1mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-301 45Degree pitch 5mm size 72.3x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-205 45Degree pitch 5mm size 30x12.5mm^2 drill 1.4mm pad 2.6mm Terminal Block Phoenix MKDS-3-2-5.08 pitch 5.08mm size 76.2x9.8mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type205_RT04506UBLC, 45Degree (cable under 45degree), 10 pins, dual row female, vertical entry, strain relief clip Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 12-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 48 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42), generated with kicad-footprint-generator Fuse SMD 0402.

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