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Corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://www.st.com/resource/en/datasheet/stspin220.pdf), generated with kicad-footprint-generator JST XH series.

8.32455 3.41238 3.82299 facet normal 3.267696e-001.
OF USE, DATA OR PROFITS, WHETHER IN CONTRACT.
BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4.

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