Labels Milestones
BackPin Placed - Wide, 5.3 mm Body with Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xx-DV-TE, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 18.
- XAL7020-681, 8.0x8.0x2.0mm, https://www.coilcraft.com/getmedia/0197e98c-67f7-4375-9e38-14d7376a46f3/xal7020.pdf Inductor, Coilcraft, XAL1580-182, 15.4x16.4x8.0mm.
- 3 x 10.1 mm, Time-Lag T, 250.
- 11 Documentation, some cosmetic sh/PCB updates.