3
1
Back

1.59472 0.0491304 facet normal -0.772955 0.634348 -0.0119325 facet normal -0.491615 -0.164793 0.855078 vertex 0.632185 -7.16112 7.08096 vertex 7.04362 0.568952 7.06725 facet normal -2.880153e-004 -5.040268e-004 -9.999998e-001 ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: front, back How to use the 4 pins (http://www.qingpu-electronics.com/en/products/WQP-PJ320D-72.html 3.5mm jack mic microphone phones headphones 4pins audio plug Headphones with microphone connector, 3.5mm, 4 pins module CMS SOT223 8 pins, pitch 7.5mm, size 69.8x14mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix PT-1,5-9-5.0-H pitch 5mm Varistor, diameter 15.5mm, width 8mm, pitch 7.5mm Varistor, diameter 15.5mm, width 7.5mm, pitch 7.5mm Varistor, diameter 16.5mm, width 6.7mm, pitch 5mm, size 17.3x14mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type701_RT11L03HGLU pitch 6.35mm size 19x12.5mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MPT-0,5-6-2.54 pitch 2.54mm size 18.2x6.2mm^2 drill 1.1mm pad 2.1mm Terminal Block WAGO 236-114, 45Degree (cable under 45degree), 16 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (https://www.akm.com/akm/en/file/datasheet/AK5394AVS.pdf#page=23), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-10DS-0.5V, 10 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 2.5, Wuerth electronics 9774150960 (https://katalog.we-online.de/em/datasheet/9774150960.pdf,), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power.

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