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WLCSP-100, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package.

9.940737e-001 vertex 4.294862e+000 -2.477929e+000 2.496000e+001 vertex -6.892284e+000 1.461804e+000.
YZP R-XBGA-N8 Texas Instruments, DSBGA.
From ef87dc7d41f5e6b2301711b754023b93f16ed69f Mon Sep 17 00:00:00 2001 Subject.
-0.382543 0.0702817 0.921261 facet normal -0.223441.

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