Labels Milestones
BackBody [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST KingTek_DSHP08TJ.
- 0.365098 0.683048 0.632574 facet normal 0.734385 -0.39254 0.553707.
- 9.04827 0 facet normal 0.362608 -0.422016 0.830914 facet.