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SOIC, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator Wuerth WR-WTB vertical Wuerth WR-WTB series connector, B2B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST PH series connector, B5B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST XH series connector, 53261-1571 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, BM08B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-10A example for new mpn: 39-28-x12x, 6 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFP, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99089A pressure sensor automotive honeywell Pressure Sensor, Dual-Barbed, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=MS5525DSO&DocType=DS&DocLang=English LEM LV25-P Voltage transducer, https://www.lem.com/sites/default/files/products_datasheets/lv_25-p.pdf LEM Hall Effect Voltage transducer 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP.

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