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SFECV, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 7.9x3.8mm^2 package SMD SMT 3.2x2.5mm, 6-pin QFN (https://www.sitime.com/datasheet/SiT9365 page 13 SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST , Piano, row spacing 10.16.

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