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Https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4x4mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST , Slide, row spacing 8.61 mm (338.

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