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Module BC95 Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-176, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-230, including GND vias (https://ww2.minicircuits.com/pcb/98-pl079.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf) according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl236.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-236, including GND vias (https://ww2.minicircuits.com/pcb/98-pl005.pdf Mini-circuits VCXO JTOS PL-005 Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for SSR made by Sharp Solid State relais SSR Sharp Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-433E STK-435E STK-436E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (ST)-4.4 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-04A2, example for new mpn: 39-29-4229, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf LQFN, 48 Pin (JEDEC MO-153 Var EF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector.

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