3
1
Back

0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x03 1.27mm double row Through hole pin header THT 1x36 1.27mm single row Through hole pin header SMD 1x40 2.00mm single row Through hole straight pin header, 2x26, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 1x37 1.00mm single row Surface mounted pin header SMD 2x31 1.00mm double row Through hole angled socket strip SMD 1x33 1.00mm single row Surface mounted socket strip THT 1x34 2.54mm single row Through hole angled pin header SMD 1x15 1.27mm single row style2 pin1 right Through hole straight pin header, 1x18, 1.00mm pitch, double rows Through hole angled pin header, 1x37, 1.00mm pitch, 2.0mm pin length, double rows Through hole socket strip THT 1x02 1.00mm single row Through hole angled socket strip THT 2x28 2.54mm double row Through hole straight pin header, 2x06, 1.00mm pitch, double cols (from Kicad 4.0.7!), script generated Surface mounted socket strip THT 1x02 1.00mm single row style2 pin1 right Through hole horizontal IDC box header 2x10 2.54mm double row surface-mounted straight pin header, 2x02.

New Pull Request