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Module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint.

• Pitch0.5mm VSSOP-8 3.0 x 2.0mm, orientation marker at.
• Normal -0.122657 -0.678289 0.724486 facet normal -4.269733e-001 9.042642e-001.
• 8.0x3.5mm^2, length*width=8.0x3.5mm^2 package, package length=10.0mm, package.

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