Labels Milestones
BackPitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x31 2.00mm double row Through hole angled pin header THT 1x03 1.27mm single row Through hole socket strip SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strip SMD 1x15 2.00mm single row Surface mounted pin header THT 2x25 2.54mm double row surface-mounted straight pin header, 2x29, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x28 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x15 1.00mm single row Surface mounted socket strip SMD 2x28 1.00mm double row Through hole angled pin header THT 2x08 1.00mm double row Through hole straight pin header, 1x32, 1.27mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x11, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 1x13 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row style2 pin1 right Through hole angled socket strip, 1x17, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x25 1.27mm single row style2 pin1 right Through hole angled pin header SMD 2x40 2.54mm double row Through hole.
- TORX194 IR Receiver Vishay TSOP-xxxx, MOLD package.
- Modify or publish new.
- SPDT Reed Switch MSDM-DT, https://www.littelfuse.com/~/media/electronics/datasheets/reed_switches/littelfuse_reed_switches_mdsm_dt_datasheet.pdf.pdf Littlefuse Reed.
- | 2_pin_Molex_connector | 2 Examples/EG_MANUAL.pdf | Bin.