Labels Milestones
BackMEJ1SxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 1W, single output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/C%20CASE/SPEC-EC6C-V12.pdf DCDC-Converter CINCON EC5BExx 18-36VDC to dual output DCDC-Converter, TRACO, TEN10-xxxx, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf muRata MEJ1SxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 2W, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf muRata MEJ1SxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 2W, SIP package style, https://power.murata.com/data/power/ncl/kdc_mgj2.pdf Murata MGJ3, 5.2kVDC Isolated 3W Gate Drive, 15V/5V/5V Configurable, 22.61x23.11x14.19mm, https://power.murata.com/datasheet?/data/power/ncl/kdc_mgj3.pdf Murata NCS1SxxxxSC https://power.murata.com/data/power/ncl/kdc_ncs1.pdf Isolated 1W single output DCDC-Converter, CINCON, EC5BExx, 18-36VDC to Dual output, Rev. March 21.2016 DCDC-Converter TRACO TEN10-xxxx single output DC/DC, http://power.murata.com/data/power/ncl/kdc_cre1.pdf Isolated 1W DCDC-Converter, http://power.murata.com/data/power/ncl/kdc_nma.pdf Murata NMAxxxxSC footprint based on https://www.analog.com/media/en/technical-documentation/data-sheets/199399fc.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S_Wide package, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 24 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 48 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://www.thatcorp.com/datashts/THAT_626x_Datasheet.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_QFN_9x9_MR_C04-00149e.pdf), generated with kicad-footprint-generator JST PH series connector, BM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator JST PH series connector, S07B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-169 , 9 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator JST PHD series connector, 202396-0507 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xxx-DV-A, 27 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-13P-1.25DSA, 13 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Mounting.
- 105309-xx02, 2 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with.
- Vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin.