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BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 461, 4.63x4.15mm.

• Contacts (40 each side), through-hole, http://www.4uconnector.com/online/object/4udrawing/10156.pdf 4UCON.
• Length of the side (HP width_mm.

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