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Plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic Shrink Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339 SO, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105309-xx02, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST VH PBT series connector, B7B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator connector JST GH series connector, B3B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0810, with PCB locator, 4 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xx-DV-PE-LC, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99066A sensor pressure ssop 98ARH99066A sensor pressure ssop 98ARH99089A pressure sensor automotive honeywell Pressure Sensor, Dual-Barbed, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=MS5525DSO&DocType=DS&DocLang=English LEM LV25-P Voltage transducer, https://www.lem.com/sites/default/files/products_datasheets/lv_25-p.pdf LEM Hall Effect Voltage transducer 3M 40-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 24-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row.

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