Labels Milestones
BackRaster, 3.347x3.585mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket.
- Universal MELF RM10 Handsoldering SMD.
- Row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator JST.
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X="5.6" y="2.7"/>
Usual pattern MS1: * <- Play.