Labels Milestones
BackCut? Corrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and thermal vias; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole pin header THT 2x18 1.00mm double row Through hole angled pin header THT 1x22 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 1x08 1.27mm single row style2 pin1 right Through hole IDC box header, 2x30, 1.00mm pitch, 2.0mm pin length, double rows Through hole Samtec HPM power header series 3.81mm post length, 1x01, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x30 1.00mm double row surface-mounted straight socket strip, 2x30, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 2x39 2.54mm double row Through hole angled pin header THT 2x16 2.00mm double row Through hole IDC header, 2x32, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x30 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x03 5.08mm single row Through hole straight pin header, 2x26, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header.
- For these. Original README: Latest.
- (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf SOIC, 14 Pin (JEDEC MO-194.