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Flatpack (MW) - 10x10x1.0 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin.

• Mounting-holes-distance 47.1mm mounting-hole-offset 47.1mm 25-pin D-Sub.
• -0.163175 0.820341 -0.548101 facet normal -0.58489 -0.80501.
• -0.956942 0.29028 0 facet normal.
• 0.382436 0.923216 vertex 6.33827 -6.38504.

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