Labels Milestones
BackSOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad.
- 2016 Péter Surányi. Redistribution.
- Normal -0.555578 -0.831465 -5.23636e-08 facet normal 0.956941.
- { cube([25, 19.25, thickness.
- | Low-Power, Dual Operational Amplifiers.
- -0.0818217 -0.993265 vertex 3.87686 3.87686 21.8439.