Labels Milestones
BackTQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g.
- NTC Thermistor <-- CV In.
- Vertex 6.37291 7.69968 0.0489512 vertex 7.20635 -6.91828.
- Size 10.2x9.8mm^2 drill 1.3mm pad 2.6mm.