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BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 12 Pin Placed - Wide, 7.50 mm Body [QFN] with thermal vias in pads, 6 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 1, Wuerth electronics 9774080482 (https://katalog.we-online.de/em/datasheet/9774080482.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1.5 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator.

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