3
1
Back

Package (ML) - 8x8x0.9 mm Body with Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad TSSOP, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32), generated with kicad-footprint-generator Molex Pico-EZmate side entry Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0508, 50 Pins per row.

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