Labels Milestones
BackHLE-124-02-xxx-DV-BE-A, 24 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.5mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST KingTek_DSHP06TS, Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge MBLS, see http://www.vishay.com/docs/89959/mbl104s.pdf http://www.vishay.com/docs/88854/padlayouts.pdf Diode Polymer Protected Zener Diode Littelfuse LS Nexperia CFP3 (SOD-123W), https://assets.nexperia.com/documents/outline-drawing/SOD123W.pdf Diode, 5KPW series, Axial, Horizontal, pin pitch=12.7mm, , length*diameter=3.2*2.6mm^2, , http://www.diodes.com/_files/packages/T-1.pdf Diode T-1 series Axial Horizontal pin pitch 5.00mm diameter 5.5mm Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/28325/021asm.pdf CP Axial series Axial Horizontal pin pitch 5.00mm 3W length 12.0mm width 8.0mm Resistor, Radial_Power series, Radial, pin pitch=5.00mm.
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