3
1
Back

Package; 56 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 9.6, Wuerth electronics 9775031960 (https://katalog.we-online.com/em/datasheet/9775031960.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1.

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