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Possible without disassembly of the board, cross at 90° to minimize capacitance between traces - .3mm for non-power lines, .6mm if carrying power - MK uses a ground plane 56529bef3a Updates from real TL0x4s re-re-remove the mysterious extra trace main Add scad for v3.2 eea453f1ee Notes about component heights, swapping rotary and toggle switches available from Tayda, per their datasheet, appear to differ in height by 1.65 mm. The 3PDT I used appears to be larger than the object they are being diffed from for ideal BSP operations holeWidth = 10.16; // If you use 9 mm or 16 mm vertical board mount OR: | | | J12 | 1 | 2_pin_Molex_header | 2 | 1N5817 | Schottky diode | | R21, R22, R23 | 3 pin Molex connector | | | | J9 | 3 | 22k | Resistor | | J6, J10, J11 | 1 | 100k | Resistor | | D 2 rotary switch - number of pins: 03; pin pitch: 5.08mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1836286 8A 320V Generic Phoenix Contact connector footprint for: MSTB_2,5/3-GF; number of pins: 06; pin pitch: 7.62mm; Vertical || order number: 1757493 12A || order number: 1757365 12A Generic Phoenix Contact connector footprint for: MC_1,5/6-G-3.81; number of pins: 05; pin pitch: 5.08mm; Vertical || order number: 1776028 12A Generic Phoenix Contact connector footprint for: MC_1,5/5-GF-3.5; number of pins: 13; pin pitch: 3.50mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1843729 8A 160V Generic Phoenix Contact SPT 5/11-V-7.5-ZB Terminal Block, 1719260 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719260), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-30DP-2DSA, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf.

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