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Mode Line Filter API Delevan, Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89020xx, 20 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, 53261-1271 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 80 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 12-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 10x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead dip package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted.

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