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Switch, 7.3mm x 6.25mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ D2PAK DDPAK TO-263 D2PAK-3 TO-263-3 SOT-404 diode TO-263 / D2PAK / DDPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf), generated with kicad-footprint-generator JST ZE series connector, S18B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Fuse SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.megastar.com/products/fusetronic/polyswitch/PDF/smd2920.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xxx-DV-BE-A, 46 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-5010, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xx-DV-PE-LC, 25 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 9 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, 501331-0207 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 4, Wuerth electronics 9774080243 (https://katalog.we-online.de/em/datasheet/9774080243.pdf), generated with kicad-footprint-generator JST XH series connector, B2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Diode SMD 3220 (8050 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1110, with PCB locator, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 14-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.

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