Labels Milestones
BackSmallPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Slide, row spacing 5.08mm, pin-spacing 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.286mm SIPAK Horizontal RM 10.9mm TO-264-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 2.54mm, staggered type-2 TO-220-9, Vertical, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.27mm staggered type-2 TO-220-11, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils.
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