Labels Milestones
Back2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 2 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 6, Wuerth electronics 9774050943 (https://katalog.we-online.de/em/datasheet/9774050943.pdf), generated with kicad-footprint-generator Molex Pico-Lock series connector, 501331-0707 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with.
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