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43160-1106, With thermal vias in pads, 2 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator connector JST ZE series connector, 502585-1070 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B15B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 2.54 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-0610, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 10 Pin (https://www.st.com/resource/en/datasheet/lps22hh.pdf#page=55), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (http://www.cypress.com/file/46236/download), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770969-x, 3 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 53047-0210, 2 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 3.5mm, size 28.7x7mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00067_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00074 pitch.

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