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BackBody [TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin with exposed pad TSSOP, 14 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN, 8 Pin (https://docs.broadcom.com/doc/APDS-9251-001-DS#page=19), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 1, Wuerth.
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