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Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14), generated with kicad-footprint-generator JST SHL series connector, B02B-JWPF-SK-R (http://www.jst-mfg.com/product/pdf/eng/eJWPF1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead.

WLCSP-36, ST die ID 460, 2.3x2.48mm, 25 Ball.
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2.47062 7.61405 19.9494 facet normal 0.370053.
Module L-band satellite communication module, https://docs.astrocast.com/dl/0532-DOC-M2M-ASTRO-Astronode_S-Datasheet.pdf.

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