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Form A, vertical mount, 6A, 5-60V, https://www.fujitsu.com/sg/imagesgig5/ftr-ly.pdf relay SPDT form c vertical Omron Relay, SPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron Relay, DPDT, https://gfinder.findernet.com/public/attachments/30/EN/S30EN.pdf AXICOM IM-Series Relays, DPDR, Pitch 3.2mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Specification+Or+Standard%7F108-98001%7FV%7Fpdf%7FEnglish%7FENG_SS_108-98001_V_IM_0614_v1.pdf%7F4-1462039-1 AXICOM IM-Series Relay J JLeg IM Signal Relay DPDT Finder 96.12 56.32 package for diode bridges, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 10.16 mm (400 mils), Socket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL ZIF 10.16mm 400mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (JEDEC MO-153 Var GA.

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