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TSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105310-xx12, 6 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Fuse SMD 2920 (7451 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.5 mm² wire, reinforced insulation, conductor diameter 0.5mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1110, with PCB locator, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py NXP LGA, 8 Pin (http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31.

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