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ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch.

• 97730256332 (https://katalog.we-online.com/em/datasheet/97730256332.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP.
• 0.0171882 0.125447 0.991951 vertex -2.47681.
• 0.0817064 -0.0814906 0.993319 vertex.
• -2.072245e+000 2.470218e+001 facet normal -0.0123052 0.156322 0.98763.
• -0.820341 -0.163177 -0.548101 facet normal -0.840149 -0.533182.

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