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DF63R-3P-3.96DSA, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM26B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-153 Var JA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 3.6, Wuerth electronics 9774090982 (https://katalog.we-online.de/em/datasheet/9774090982.pdf), generated with kicad-footprint-generator connector Molex Pico-Lock series connector, B03B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin Placed - Wide, 7.50 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads in-line, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Vertical, RM 2.54mm, staggered type-1 TO-220-11, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-7 Horizontal RM 2.54mm TO-220-4 Vertical RM 2.54mm staggered type-2 TO-220-9, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-9, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-15, Horizontal, RM 2.54mm TO-220F-3, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 2.54mm TO-218-2, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220-7, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 2.54mm TO-247-5, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST , Slide, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row.

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