Labels Milestones
BackPackage; 32 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area.
- -4.075203e-001 -7.106009e-001 5.735623e-001 vertex 4.315806e+000 3.336501e+000 2.480400e+001 facet.
- WLCSP-18, ST Die ID 466.