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BackFor an e-drum kit. 0 0 Y N 1 F N DEF SW_Push_Dual SW 0 40 Y N 2 F N DEF SW_DIP_x09 SW 0 20 Y N 1 F N DEF SW_Coded_SH-7010 SW 0 0 Y N 1 F N Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png create mode 100644 3D Printing/Pot_Knobs/scaled_french_pot.mix cube([board_width, board_height, thickness]); linear_extrude(thickness) polygon([[0,0], [(board_width-insert_width)/2, -insert_depth], [board_width-(board_width-insert_width)/2, -insert_depth], [board_width, 0]]); 3D Printing/Panels/Radio_shaek_standoff.stl | Bin 26014376 -> 26031216 bytes // PCB holder main MK_VCO/Panels/Font files/futura medium bt.ttf differ Latest commits for file Schematics/Dual_VCA.diy Bring in diylc and openscad design ## Mechanical assembly Documentation # ---> KiCad # For PCBs designed using KiCad: https://www.kicad.org/ # Format documentation: https://kicad.org/help/file-formats/ # Temporary files *.000 *.bak *.bck *.kicad_pcb-bak *.kicad_sch-bak *-backups *.kicad_prl *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache # Netlist files (exported from Pcbnew) *.dsn *.ses New KiCad version; non Al panel Gerbers # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: merged pull.
- Pitch 0.65mm Slug Down Thermal Vias.
- 24V, 8A, no switch.
- Size 30.5x10.6mm^2, drill diamater 1.2mm, pad diameter.