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THT 1x35 1.00mm single row Surface mounted pin header THT 1x13 5.08mm single row Through hole angled socket strip, 1x36, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x15 5.08mm single row Through hole socket strip SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 2x30 2.54mm double row surface-mounted straight socket strip, 2x22, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header THT 2x04 1.27mm double row Through hole straight pin header, 2x26, 1.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip SMD 2x37 1.27mm double row surface-mounted straight pin header, 1x26, 2.54mm pitch, double rows Surface mounted pin header SMD 1x35 2.54mm single row Surface mounted pin header THT 2x04 1.27mm double row surface-mounted straight socket strip, 2x19, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x36, 2.54mm pitch, single row style2 pin1 right Through hole IDC header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip SMD 2x34 1.00mm double row Through hole angled socket strip THT 2x21 1.00mm double row surface-mounted straight socket strip, 2x21, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x22 2.54mm double row Through hole straight pin header, 1x21, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 64 Pin (https://www.infineon.com/dgdl/Infineon-MA12040-DS-v01_00-EN.pdf?fileId=5546d46264a8de7e0164b7467a3d617c#page=81), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18.

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