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- 3x3x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator connector Molex KK-396 horizontal Molex KK 396 Interconnect System, old/engineering part number: A-41791-0016 example for new mpn: 39-29-4169, 8 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (JEDEC.

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