Labels Milestones
Back9.181025e+01 1.055000e+01 facet normal -0.590358 -0.804069 0.0703596 facet normal 3.025300e-001 -5.178213e-001 8.002104e-001 facet normal -9.369179e-001 -4.171483e-003 3.495247e-001 facet normal 0.766833 0.634118 0.0993045 vertex 8.09017 -5.87785 0 facet normal -0.29705 0.243786 0.923217 vertex 8.26214 -3.54289 3.82299 facet normal 0.0821747 0.0822608 0.993217 facet normal -2.304122e-004 -4.032215e-004 -9.999999e-001 Latest commits for branch sandwich Checkpoint before trying to add glide db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502382-1070 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf.
New Pull Request