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Package (JQ) - 4x4x0.5 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x6.64mm 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST Copal_CHS-06B, Slide, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81.

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