Labels Milestones
Back(see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20.
- 09-65-2118, 11 Pins per row.
- 0.4mm, outer diameter 1.5mm, size.
- Normal 3.874186e-001 6.779824e-001 6.246973e-001 facet normal -4.743276e-01 0.000000e+00.