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Width 2.7mm Capacitor C, Rect series, Radial, pin pitch=26.67mm, , diameter=28mm, Bourns, 2200, http://www.bourns.com/docs/Product-Datasheets/2100_series.pdf?sfvrsn=3 L_Toroid Horizontal series Radial pin pitch 5.00mm diameter 10.5mm C, Axial series, Axial, Horizontal, pin pitch=15.24mm, , length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf Inductor Axial series Axial Horizontal pin pitch 2.54mm size 20.8x6.2mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type703_RT10N02HGLU, 2 pins, diameter 3.0mm, hole diameter 2.0mm THT pad rectangle square SMD pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Laser Gaming Sensor ADNS-9800 Fiberoptic Transmitter TX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.15 mm² wire.

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