3
1
Back

Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-18A2, example for new part number: A-41791-0010 example for new mpn: 39-28-902x, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 (so is open or ground). Part of \nloop mod Part of speed \nswitch mod (0 F.Cu signal hide (33 F.Adhes user (34 B.Paste user (35 F.Paste user (36 B.SilkS user (37 F.SilkS user (38 B.Mask user (39 "F.Mask" user (40 Dwgs.User user.

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