Labels Milestones
BackS2-KS/LS/US, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, hand-soldering, 9.1x7.2mm^2 package Miniature Crystal Clock Oscillator ECS 2520MV series, https://www.ecsxtal.com/store/pdf/ECS-2520MV.pdf Miniature Crystal Clock Oscillator IQXO-70, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, 7.5x5.0mm^2 package IQD Crystal Clock Oscillator TXCO Fordahl DFA S15-OV/UOV, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, hand-soldering, 19.9x12.9mm^2 package Miniature Crystal Clock Oscillator Abracon ASV series, http://www.abracon.com/Oscillators/ASV.pdf, 7.0x5.1mm^2 package Miniature Crystal Clock Oscillator ECS 2520MV series, https://www.ecsxtal.com/store/pdf/ECS-2520MV.pdf Miniature Crystal Clock Oscillator EuroQuartz XO32 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO32.pdf, 3.2x2.5mm^2 package SMD Crystal EuroQuartz MQ2 series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package SMD Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package SMD Crystal MicroCrystal CC1V-T1A series https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/CC1V-T1A.pdf, 8.0x3.7mm^2 package SMD Crystal EuroQuartz EQ161 series http://cdn-reichelt.de/documents/datenblatt/B400/PG32768C.pdf, 3.2x1.5mm^2 package SMD Crystal Oscillator Seiko Epson MC-505 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Crystal MicroCrystal CC7V-T1A/CM7V-T1A series https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/CC7V-T1A.pdf, 3.2x1.5mm^2 package SMD Crystal MicroCrystal CC4V-T1A series http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf, 5.0x1.9mm^2 package SMD Resomator/Filter Murata CSTCE, https://www.murata.com/en-eu/products/productdata/8801162264606/SPEC-CSTNE16M0VH3C000R0.pdf SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBJ0008 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package.