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Connectors, 90325-0022, 22 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Capacitor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 32 Pin (http://www.thatcorp.com/datashts/THAT_5171_Datasheet.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 18 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 44 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN.

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