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Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (JEDEC MO-153 Var CC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SPOX horizontal Molex SPOX horizontal Molex KK 396 Interconnect System, old/engineering part number: 22-27-2151, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Inductor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size.

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